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| www..com Bulletin I0509J rev. A 05/01 SC070.....5. Series SCHOTTKY DIE 70 x 92 mils a c 0.35 0.01 (14 0.4) NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS). 2. CONTROLLING DIMENSION: (MILS). C A D b d O 40 (157) 4. LETTER DESIGNATION: A = Anode (Top Metal) C = Cathode (Back Metal) D = Reject Ink Dot (only on non-conforming dies) 5. SAWING: Recommended Blade SEMITEC S1025 QS00 Blade Sawing Street 0.05 + 0, - 0.005 (2 + 0, - 0.2) Wafer flat alligned with side b of the die O 125 (492) ww..com NOT TO SCALE NOTE: 10 mils die thickness is available on specific request only. Contact factory for information. www.irf.com 1 www..com www..com www..com 4U DataSheet 4 U .com www..com 3. DIMENSIONS AND TOLERANCES: a = 1.78 + 0, - 0.01 (70 + 0, - 0.4) b = 2.34 + 0, - 0.01 (92 + 0, - 0.4) c = 1.63 + 0, - 0.01 (64 + 0, - 0.4) d = 2.18 + 0, - 0.01 (86 + 0, - 0.4) O = 0.7 0.1 (30 4) www..com SC070.....5. Bulletin I0509J rev.A 05/01 Electrical Characteristics Device # SC070R015x5x SC070S020x5x SC070S030x5x SC070S045x5x SC070S060x5x SC070H045x5x SC070H100x5x SC070H150x5x TJ Max. (C) 125 150 150 150 150 175 175 175 VR (V) 15 20 30 45 60 45 100 150 12 5 2 90 70 Typ. IR @ 25C (A) Typ. IR @ 125C (mA) Max. VF @ IF (V) Package Style n.a. contact factory n.a. contact factory 38 32 0.55 @ 12A 0.70 @ 15A DPAK (TO-252) TO-220 n.a. contact factory 4 2.5 1.5 0.56 @ 15A 0.95 @ 12A 1.1 @ 10A TO-220 DPAK (TO-252) TO-220 Mechanical Data Device # SC070xxxxA5x SC070xxxxS5x Wire Bondable Solderable -Ti 2 kA Metal Thickness Front Metal Al 30 kA Ni 1 kA -Ag 35 kA Cr 1 kA Cr 1 kA Metal Thickness Back Metal Ni 2 kA Ni 2 kA Ag 3 kA Ag 3 kA Recommended Storage Environment: Store in original container, in dessicated nitrogen, with no contamination. Shelf life for parts stored in above condition is 2 years. If the storage is done in normal atmosphere shelf life is reduced to six months. Packaging Device # SC070xxxxx5B SC070xxxxx5R Description Minimum Order Quantity Die in Sale Package 2500 n.a 2500 2500 Inked Probed Unsawn Wafer (Wafer in Box) Probed Die in Tape & Reel Probed Die in Waffle Pack Inked Probed Sawn Wafer on Film ww..com SC070xxxxx5P SC070xxxxx5F 2 www.irf.com www..com www..com www..com 4U DataSheet 4 U .com www..com www..com SC070.....5. Bulletin I0509J rev. A 05/01 Ordering Information Table Device Code SC 070 1 1 2 3 4 5 6 7 Schottky Die Chip Dimension in Mils Process (see Electrical Characteristics Table) Voltage code: Code = VRRM 2 S 3 045 4 A 5 5 6 B 7 H = 830 Process R = OR'ing Process S = Standard Process Chip surface metallization (see Mechanical Data Table) Wafer Diameter in inches Packaging (see Packaging Table) Wafer on Film ww..com www.irf.com 3 www..com www..com www..com 4U DataSheet 4 U .com www..com www..com SC070.....5. Bulletin I0509J rev.A 05/01 Wafer in Box ROUND CONTAINER TYVEK DISK FOAM DISK Die in Waffle Pack ww..com CHIP TRAY POCKET 4 www.irf.com www..com www..com www..com 4U DataSheet 4 U .com www..com www..com SC070.....5. Bulletin I0509J rev. A 05/01 ww..com WORLD HEADQUARTERS: EUROPEAN HEADQUARTERS: IR CANADA: IR GERMANY: IR ITALY: IR FAR EAST: IR SOUTHEAST ASIA: IR TAIWAN: http://www.irf.com 233 Kansas St., El Segundo, California 90245 U.S.A. Tel: (310) 322 3331. Fax: (310) 322 3332. Hurst Green, Oxted, Surrey RH8 9BB, U.K. Tel: ++ 44 1883 732020. Fax: ++ 44 1883 733408. 15 Lincoln Court, Brampton, Markham, Ontario L6T3Z2. Tel: (905) 453 2200. Fax: (905) 475 8801. Saalburgstrasse 157, 61350 Bad Homburg. Tel: ++ 49 6172 96590. Fax: ++ 49 6172 965933. Via Liguria 49, 10071 Borgaro, Torino. Tel: ++ 39 11 4510111. Fax: ++ 39 11 4510220. K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo, Japan 171. Tel: 81 3 3983 0086. 1 Kim Seng Promenade, Great World City West Tower,13-11, Singapore 237994. Tel: ++ 65 838 4630. 16 Fl. Suite D.207, Sec. 2, Tun Haw South Road, Taipei, 10673, Taiwan. Tel: 886 2 2377 9936. Data and specifications subject to change without notice. Fax-On-Demand: +44 1883 733420 www.irf.com 5 www..com www..com www..com 4U DataSheet 4 U .com www..com |
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